| Keywords | ceramic circuit board, RF Power, RF-Power, ceramic-substrate, Keramiksubstrat, wireless infrastrukture, defence electronics, microwave technology, amplifire, receiver, hf-receiver, antenna beam, antennenverstärker, prototype design, couplers, Koppler, Hochfrequenzkoppler, Lesitungsverstärker, HF-resonatoren, Resonator, HF resonator, microsystemtechnik, Mikrosystemtechnik, Microelectronics, Mikroelektronik, Microtechnology, Mikrotechnologie, Analytik, Analytic, Litograhieprozess, Faseroptische Systeme, faseroptic, Packaging, erhöhte Verlustleistung, geringe Versorungsspannung, Hochfrequenz, high frequenz, steigende I/O Anschlüsse, Verbindungstechnologie, connection, SCP single chip package, Fine-Pitch-Bonden, Hochfrequenzbauteile, high frequenz component, Optoelektronische Anwendung, optoelectronical applikation, hochintegriebar, Wärmeleitfähigkeit, Metallisierung, chemisch Nickel, chemisch Gold, Kobalt Gold, vergolden, verzinnen, vernickeln, galvanisieren, elektroplating, versilbern, Metal deposition, firing, electroplating, electroless plating, imaging, etching, high pressure spray eching, 96% alumina ceramic, Aluminiumoxide, Aluminium Nitride, ALN, Al2O3, ceramic coated stell, coating, polimide, copper, electroplated copper, electroplated Nickel, electroplated Gold, Electroplated Tin & Tin-Lead, electroless copper, electroless silver, electroless Nickel, electroless Gold, Silver & Gold Based Fritted Conductors, Wire bonding, Alu wire bonding, Gold wire bonding, Microwave, low power, power converters, Multichip Modules |
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